Infiniband Cluster Interconnects
Low-latency fabric for HPC clusters and AI supercomputers.
PERFORMANCE HARDWARE SOURCED, BUILT, AND OPTIMIZED.
PRODUCTS
High-density servers, storage, networking, components, and modular data centers sourced and optimized for demanding workloads.
Each product path is engineered with precision, sustainability, and scalability so infrastructure can grow without wasting power, space, or budget.
PRODUCT FAMILIES
Pick the layer that sets the pace. We then tune the rest of the stack around the workload, site, and operating model.
High-Performance ServersDense AI, HPC, edge, and hybrid servers for compute-heavy workloads.
Storage SolutionsNVMe, all-flash, hybrid, software-defined, backup, and archive storage paths.
Advanced NetworkingFast Ethernet, InfiniBand, SmartNICs, DPUs, security, and monitoring.
Premium ComponentsProcessors, GPUs, motherboards, and chassis selected for balanced performance.
Modular Data CentersCertified modular data centers for rapid deployment and scalable growth.
Analytics ToolsTools that turn deployed infrastructure into actionable operating insight.
COMPUTE
Compute choices are framed around density, cooling, and the type of workload that has to keep moving.
AMD and NVIDIA accelerator paths with high-bandwidth connectivity.
AMD EPYC platforms with scalable memory configurations.
Lower noise and improved reliability versus traditional air-cooled paths.
Useful for analytics, inference, and simulation on one platform.
Extended temperature and dust-resistant enclosure options.

DATA
Storage is matched to the data path: hot model data, mixed enterprise workloads, or durable backup and archive.
Compact 1U/2U capacity with AMD EPYC I/O throughput.
Expandable toward petabyte-scale environments.
Redundant controllers and networking for availability.
Compatible with common SDS platforms and proprietary solutions.
Tape, cloud tiering, deduplication, and automated workflows.
FABRIC
The fabric is treated as a performance system: bandwidth, latency, offload, and visibility move together.
Low-latency fabric for HPC clusters and AI supercomputers.
Modular switches and adapters for scalable bandwidth and segmentation.
Hardware offload for networking, security, virtualization, and storage stacks.
Layer 7 visibility, threat detection, and SIEM integration.
BUILDING BLOCKS
A compact layer for targeted upgrades, custom builds, and performance tuning.

High core counts, memory bandwidth, and security features.
AMD and NVIDIA accelerator paths for AI, graphics, and compute.
GPU-optimized form factors, thermal design, power delivery, and expansion.
FACILITIES
Certified capacity that can move faster than a traditional building project.

Add capacity as demand evolves.
Bring compute to remote or urgent locations faster.
Use efficient components and engineered cooling from the start.
Cover seasonal spikes or project-based demand.
Stand up resilient recovery capacity in challenging scenarios.
INSIGHT
Operational tooling turns deployed hardware into signals teams can act on.

BESPOKE
The section where product families become an engineered environment.

Prefabricated units, steel structures, and architectural cladding.
White space, staging, storage, NOC rooms, and office areas.
Technical requirements, safety, durability, and environmental performance.
EFFICIENCY
Efficiency is handled as an engineering constraint, not an afterthought.

Lower energy waste across product choices.
Compute, cooling, and power tuned together.
Up to 40% reduction in electricity costs for enterprise data centers.
Work with us to explore ElioVP’s premium computing components, high-performance servers, and other innovative products to help your business achieve its performance and sustainability goals.